JPS6033437U - リ−ド無しチップキャリヤ構造 - Google Patents

リ−ド無しチップキャリヤ構造

Info

Publication number
JPS6033437U
JPS6033437U JP12332483U JP12332483U JPS6033437U JP S6033437 U JPS6033437 U JP S6033437U JP 12332483 U JP12332483 U JP 12332483U JP 12332483 U JP12332483 U JP 12332483U JP S6033437 U JPS6033437 U JP S6033437U
Authority
JP
Japan
Prior art keywords
chip
chip carrier
carrier structure
leadless chip
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12332483U
Other languages
English (en)
Japanese (ja)
Other versions
JPH034039Y2 (en]
Inventor
康夫 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP12332483U priority Critical patent/JPS6033437U/ja
Publication of JPS6033437U publication Critical patent/JPS6033437U/ja
Application granted granted Critical
Publication of JPH034039Y2 publication Critical patent/JPH034039Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP12332483U 1983-08-10 1983-08-10 リ−ド無しチップキャリヤ構造 Granted JPS6033437U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12332483U JPS6033437U (ja) 1983-08-10 1983-08-10 リ−ド無しチップキャリヤ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12332483U JPS6033437U (ja) 1983-08-10 1983-08-10 リ−ド無しチップキャリヤ構造

Publications (2)

Publication Number Publication Date
JPS6033437U true JPS6033437U (ja) 1985-03-07
JPH034039Y2 JPH034039Y2 (en]) 1991-02-01

Family

ID=30281557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12332483U Granted JPS6033437U (ja) 1983-08-10 1983-08-10 リ−ド無しチップキャリヤ構造

Country Status (1)

Country Link
JP (1) JPS6033437U (en])

Also Published As

Publication number Publication date
JPH034039Y2 (en]) 1991-02-01

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